(Invited) Transistor Strain Measurement Using Electron Beam Techniques

Abstract

Strain and the related stress in nanoelectronic devices play a critical role in semiconductor technologies. In general, strain arises from the lattice mismatch between dissimilar materials and thus strain is critical for the design and growth of epitaxial heterostructures in micro- and nano-electronics. In transistors, strained silicon channels provide a major boost to the performance of metal-oxide-semiconductor field-effect transistors (MOSFETs), e.g., the use of epitaxial strain of Si and Ge alloys in PMOS [1]. In the near term, the transistor technology is pushing towards the sub 10 nm technology node. At this length scale, resolving strain in the devices requires a resolution of sub nanometer with not only high resolution, also high accuracy and reliability. The use of novel architectures and alternative materials in the transistor technology also demands metrology capable of handling these structural and material changes. High resolution strain measurement can be performed using high energy electrons either in reciprocal space using convergent beam electron diffraction (CBED), scanning electron nanodiffraction (SEND), nanobeam electron diffraction (NBED) [2], or scanning precession electron diffraction (SPED) or in real space through direct imaging using high resolution electron microscopy (HREM), scanning transmission electron microscopy (STEM) [3] or dark-field electron holography (DFEH)[4]. The resolution and strain measurement sensitivities range from Å to several nm and 10-3 to 10-4respectively. Recent developments in aberration corrected STEM especially have improved the spatial resolution to sub- Å and the precision of measuring atomic column positions to picometers [3]. This talk will review high resolution and high sensitivity electron beam techniques for strain characterization in nanodevices and device materials. Examples include planar and a finfet transistors and III-V heterostructures. For finfet transistors, we demonstrate that NBED provides an effective approach for strain mapping (See figure below) and some of challenges will also be highlighted. In III-V heterostructures, we will describe atomic resolution Z-contrast imaging based methods for high resolution interfacial strain analysis and its applications for the investigation of interfacial intermixing and atomic layer-by-layer strain profiles in InAs/GaSb and InAs/InAsSb superlattices, targeted for middle- and long-wavelength IR detection.