(Invited) Semiconductor Packaging Technology to Progress the IoT Era

Abstract

In the world economy there is a wave of the booming economy and the recession, the wave of the booming economy is going by the industry of technology innovation. Until now, the invention of the steam engine, transportation of development, has been repeated waves of good / recession of the economy by the invention of the electrical / communication. Now, the wave of major technological innovation has been visited by the progress of the Internet and the computer. It is a technique called IoT (Internet of Things) is connected and all of the places and things in the Internet, to accumulate an enormous amount of information, a wave of AI (Artificial Inteligence) is going to processing. Server for IoT era is referred to as a sensor and the edge can be determined that data to collect the information, also AI server to handle Big Data is needed. Such sensors or servers, it is important to semiconductor development for processing data in high-density memory and fast. On the other hand due to the limit of the semiconductor of the fine or photolithography, it is no longer the case is Moore's Law. As a result, technology of packaging the device in a high density is important. DRAM is, TSV (Through Via Silicon) HBM using (High Band Width Memory) and HMC (Hybrid Memory Cube) has been mass-produced is already a memory. System connecting the GPU (Graphic Processor Unit) using the Si interposer called 2.5D is still being produced. However, TSV Si Interposer called these 3D is in the advance in the future IoT because of the high cost, it is difficult to be used in general to modularize the large number of sensors. Development has been the development of new packaging technology, such as that in FOWLP. I want to discuss the outlook and its Overview.