(Invited) Metrology of Molecular Devices Made by Flip Chip Lamination

Abstract

Scaling of conventional electronics has continued unabated to dimensions approaching fundamental physical limits. As technology continues to evolve there are increasing demands to identify alternate routes of performing electrical functions. One novel device architecture is molecular electronics. The fabrication and metrology of molecular based devices has progressed but remains challenging. We have focused our efforts on silicon-based molecular electronic devices and developed a crucial understanding of the formation and characterization of molecular electronic devices. This paper gives an overview of our technology highlighting formation of monolayers and metallization of the monolayers. Characterization of metal-monolayer-silicon structures will be discussed throughout.