(Invited) Improvements in Thermal Budget and Film Properties Using Low Pressure Cure Technology for Advanced 3D Integration Packaging

Abstract

3D advanced integration with Fan-Out Wafer-Level Packaging (FOWLP) and Fan-Out Panel Level Packaging (FOPLP) offers multiple benefits: heterogenous chip design and stacking, increased interconnect density, and improved performance. However, it also brings new requirements for more compact form factors, low thermal budget materials and processing, and lower cost. The materials, process, and fabrication of heterogenous integration on redistribution layers (RDLs) consisting of metal and polymer dielectrics have become important enablers of the move to advanced packaging applications. To achieve the low-stress and low-cost benefits required by advanced integrated devices, thermal budgets must be reduced throughout the heterogenous integration flow -- including the dielectric curing step, which demands the use of low temperature processing and reduced cure times.In this presentation, the low temperature and low pressure thermal polymerization of dielectric polyimides used for redistribution layers (RDLs) is reviewed. Specifically, this presentation illustrates the significant impact of the low pressure cure process in reducing temperature (20° to 50° lower) and cure times (up to a 50% reduction) while providing better mechanical (elongation%, tensile strength, Young’s modulus), thermal (TG, Td 1%, Td 5%), and electrical (Dk, Df, dielectric breakdown strength - DBS) properties for different types of dielectric polyimides, including the Fujifilm LTC-9300 series, the Asahi BL-300 series, and the Toray LT-8300 and PW-1500 series. The post-curing polymerization ratio (FT-IR) and film stress were studied and are described. Finally, a proposed mechanism for the described dielectric polyimides’ polymerization under reduced pressure is discussed.Ongoing developments in design, materials, process and fabrication for FOWLP and FOPLP devices continue to drive progress in 3D heterogenous integration. This study of thermal processing of dielectric polyimides at low pressure and shorter time demonstrates a promising technique to improve overall process flow by reducing thermal budget, stress, and cost.