(Invited) Heterogeneous Electronics Packaging Innovations Based on Silicon Technology

Abstract

Electronics Packaging refers to the electrical interconnection of heterogeneous dies using a hierarchy of packaging constructs. Today’s packaging is based on organic substrates called FR4 – glass reinforced epoxy laminate material with coarse pitches and solder-based connections. which have not shrunk over the last several decades. More recently however, packaging is undergoing materials and integration innovations that promise to usher in an era of package and board level scaling. These borrow extensively from silicon technology. We will address two such approaches: The Silicon Interconnect Fabric (Si IF), where we attempt to replace the PCB with a Silicon wafer that has fine wires and directly connects to heterogeneous dielets using solderless thermal compression bonding, to build large heterogeneous Systems on Wafers; and Flextratetm, a PDMS based flexible biocompatible substrate, that uses a fan-out wafer level processing approach to similar things. The talk will address the materials and processing challenges of these approaches.