Abstract

Germanium is considered to be an alternative channel material for advanced CMOS devices. Due to its small bandgap and high mobility, it can allow operation of devices at low supply voltage without loss of performance. The main obstacle for implementation of an all-Ge CMOS technology is the frequently observed underperformance of Ge n MOSFETs. Part of the problem could be that acceptor interface states in Ge lie in the low part of the energy gap close to the valence band so that the interface is easily charged negatively affecting transport in the n-channel. Additional and perhaps more severe complications arise from defects generated by poor quality oxides. Improving the quality of GeO2 large progress in Ge n MOS has been made albeit not without concerns about scalability to low equivalent thickness. Rare earth La germanate dielectrics exhibit good passivationg properties probably due to the suppression of harmful reactions of the dielectric with the substrate and maintain these good properties at low equivalent thickness suggesting a good potential for scalability.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.