Abstract
Direct Ink Writing (DIW) has recently emerged as a revolutionizing 3D printing technology for automated, cost-effective, and smart manufacturing of flexible and wearable electronic devices. Due to huge potential of flexible and wearable electronic devices in healthcare, sports, portable electronics, aircraft structures, robotics, etc., it is imperative to find the reliable and cost-effective methods to shift conventional rigid electronics to flexible/ wearable electronics. DIW process is highly efficient to fabricate high performance supercapacitors due to its processing capability to print wide range of materials and its simplicity. This work is focused on the fabrication of silicon and graphene-based supercapacitors using DIW and their application for flexible, stretchable, and wearable electronics. Different critical parameters for DIW such as rheology requirements of inks, material selection for electrode/ electrolyte, surface requirements to ensure better adhesion between printing layers, mechanical/ material testing of fabricated devices, and their electrochemical performance have been discussed to get a reliable energy storage device.
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