Abstract
3DIC/TSV is the most promising candidate for high-performance and low-power computing devices. They have many advantages such as short wiring length, small pin capacitances, high packing density, ultra-parallel operation. Among several types of 3D-IC technologies, multiple chips-to-wafer (MCtW) stacking can stack known-good chips fabricated with different technologies and sizes, leading to a true 3D heterogeneous system. We have developed a fully implantable retinal prosthesis with a 3D-stacked artificial retina (AR) chip. In the 3D-stacked AR chip, the photoreceptor chip and stimulus current generator with image processing circuits are vertically stacked and electrically connected by many TSVs. Furthermore, advanced packaging technology like FOWLP is being developed to implement multiple AR chips in a flexible substrate to obtain a wide viewing angle. This leads to small chip size, lightweight, large fill-factor, high resolution, and high quality of life patients.
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