(Invited) Deformable Electronics Based on Strain-Engineered Van Der Waals Materials

Abstract

Materials exhibit drastically different physical and chemical properties as their dimensionality varies. Atomically-thin van der Waals (vdW) materials possess unique mechanical, electrical, optical, and thermal characteristics, originated from quantum confined low-dimensionality and a lack of dangling bond. In particular, strong in-plane covalent bonding and weak interlayer vdW interaction of two-dimensional (2D) vdW materials enable exceptional combination of mechanical properties, such as high Young’s modulus, high in-plane strength, and ultralow bending stiffness at a level of cell membrane. Moreover, mechanical strain can induce modulation of electronic and phononic band structures of 2D vdW materials more effectively due to mechanical resilience and high surface-to-volume ratio. For these reasons, deformation engineering has garnered substantial interest in mechanics, materials and electronics communities as a new tuning knob for emerging phenomena and functionalities of 2D vdW materials. In this talk, I will discuss deformation engineering of 2D vdW materials – (1) active and dynamic deformation strategies, including in-plane interfacial slippage and out-of-plane structural deformation, (2) deformation strain induced phenomena, and (3) emerging device concepts based on deformation engineering of 2D vdW materials.