(Invited) Computational Insights to Dielectric Hybrid Glasses Under Nanoscale Confinement for Next Generation Devices

Abstract

Low and Ultra-k dielectric organosilicate glasses (OSG) are widely used in device interconnect applications such as shallow trench isolation as insulating units. However, the process of gap filling between conducting units has been challenging. One of the challenges is related to the undesired formation of nanovoids in the low-k dielectric material confined inside the trench geometry. Importantly, the effects of such nanoscale device constraints on the structure and mechanical reliability of low-k dielectric hybrid materials are not very well understood. To close this lack of understanding and guide the related experimental efforts we performed molecular dynamics simulations where we explore the role of the molecular structure and connectivity of different low-k dielectric OSG precursors under nanoscale confinement, and predict the resulting elastic and fracture properties. We demonstrated that hyperconnected OSG precursors with aromatic rings, such as the 1,3,5-benzene molecule, pack more homogenously under confinement leading to smaller nanovoids and better mechanical reliability compared to conventionally bridged OSG precursors, such as the ethylene bridged Et-OCS molecule.