Abstract
Among the advanced electronic devices, transparent flexible organic electronic devices with rapid development are the most promising technologies to customers and industries. However, thin film encapsulation (TFE) and transparent oxide conductive (TOC) of organic devices still remain a big challenge, because of the difficulty in low temperature and low plasma power fabricating process. Atomic layer deposition (ALD) is increasingly used in the field of organic electronics. However, the deposition of ALD outside the temperature window still cannot be stably implemented. In this study, transient steric hindrance caused by gas-phase molecules at low-temperature (80℃) was investigated. In order to mitigate the effect of this transient hindrance, a process of consecutive short-pulses was adopted in fabricating TFE and TOC. Overall, the proposed idea would help low temperature ALD for organic electronics become mature and be widely promoted.
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