Abstract
The lotus type porous copper heat sink has a higher heat transfer capacity as compared to micro channel heat sink for same size. Many studies on this heat sink show that its heat transfer capacity can be further improved by improving design of heat sink. This study investigates the heat transfer and flow characteristics of porous heat sink with different designs of internal bifurcations under both laminar & turbulent flow and studies the effect of such bifurcations on heat transfer of heat sink. The results of heat sink with bifurcations are compared with that of heat sink without bifurcations which show that for case of both laminar & turbulent flow, the heat sink with bifurcation showed better thermal performance as compared to heat sink without bifurcations.
Highlights
For quite a long time, there has been focus on reducing the size and volume of electronic devices
As seen for the case of laminar flow, the heat sink with no bifurcations corresponding to case d has a lower pressure drop as compared to all other heat sinks with bifurcations
It is seen that with increase in Reynolds number there seems to be an increase in pressure drop as well and the velocity at which the pressure drop reaches maximum is based on design of bifurcation in heat sink and on physical properties of fluid
Summary
For quite a long time, there has been focus on reducing the size and volume of electronic devices. On other hand with development of technology and need for more complex functions, there has been development on integrating different functions of electronic devices into single component. This has resulted in increasing the amount of heat released by such devices. Such situations call for design of cooling systems with good thermal performance but should be lesser in weight This cannot be achieved by traditional methods of cooling such as use of fans with air as coolant as it occupies more space and there occurs more noise with increasing size. This emphasizes on need of such studies on increasing thermal performance of cooling systems such has heat sinks, heat exchangers etc
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