Abstract

The present research investigates the performance of a proposed variable channel width double-layered minichannel heat sink (VWC DL-MCHS) with advanced coolants. Nanofluids such as Al2O3–water and CuO–water with nanoparticle concentration (Op) of 1%, 5% and 9% and n-octadecane–water NEPCM slurries with particle concentration (Cm) of 5%, 10% and 20% are used as advanced coolants. Along with that, the effect of the dimensionless stepped fin length (λ) on the thermal performance of a VWC DL-MCHS is investigated by considering various values of λ (0.2, 0.4, 0.6, 0.8 and 1). The results show that VWC DL-MCHS performs better as compared to conventional DL-MCHS. A VWC DL-MCHS with zero overlap and λ = 0.8 using CuO–water (Op = 1%) nanofluid as coolant turns out the best configuration. Therefore, a VWC DL-MCHS with λ = 0.8 and zero overlap with advanced coolants would serve as an efficient thermal management solution for microelectronics devices.

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