Abstract
This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.
Highlights
Industrialists and researchers have diverted their focus towards miniaturization of electronic appliances over the last decade
Géczy et al [9] used an explicit model to imitate the Vapour phase soldering (VPS) to resolve the issue of film-wise condensation heat transfer based on the Nusselt theory
The turbulent CFD codes, the RNG k-epsilon (RNG KE) model is selected by considering swirl dominated flow which consists of two transport equations as follows:
Summary
Industrialists and researchers have diverted their focus towards miniaturization of electronic appliances over the last decade. The formation and motion of the layer and convective temperature transport effect were required for the dynamic approximation Another widely used but not often scientifically investigated method employed a radiation reflow oven. The existing literature on the heat transfer in the soldering process can be classified based on radiation and forced convection. To investigate the effect of IR heater heat flux and the airflow of the 3D reflow oven on thermal characteristics, numerical and experimental methods were conducted. The DO model was considered to be suitable for desktop reflow oven for the soldering process with a localized heat source. The turbulent CFD codes, the RNG k-epsilon (RNG KE) model is selected by considering swirl dominated flow which consists of two transport equations as follows:.
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
