Abstract

The residual stress on the ground surface of workpiece in high efficiency deep grinding (HEDG) has been investigated. It has been found that the mechanism in forming the ground surface residual stress in HEDG is much different to that in the conventional shallow cut grinding process. It is not a thermally dominant event as in most of the shallow cut grinding mode; it is instead driven by the combined effects of both the thermal and mechanical loadings. The compressive plastic deformation near the workpiece surface during grinding and the short contact time in the HEDG regime, makes it possible to generate compressive surface stresses even when the surface temperatures are above 700-800°C.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call