Abstract
This paper presents the results of investigations on the microcracking of composite ceramic materials, such as electrical engineering porcelain and silicon nitride ceramics, using the acoustic emission technique. The analytical expression describing the kinetics of microcrack accumulation is refined. The influence of the loading rate on the strength characteristics of ceramics and the special features of acoustic emission during their cracking are studied. The dependence of the total acoustic emission count on the stressed surface area of specimens is found. The notion of the microcracking modulus of ceramic composite materials is introduced and its mismatching with the Weibull modulus in strength tests of ceramics is shown.
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