Abstract
Parallel devices in nonuniform conditions can easily lead to reduced overall reliability or even failure due to uneven energy distribution. Especially under long-term avalanche stresses, the degradation of the device may have a great impact on the electrical parameters and performance. To study the degradation tendency and aging mechanism of parallel-connected silicon carbide (SiC) MOSFET, the repetitive unclamped inductive switching (UIS) experiments are carried out in this article. Technology computer-aided design (TCAD) simulations are utilized to simulate the temperature change and current distribution of the chip during an avalanche. The results showed that for planar and trench devices, the electrical parameters drifts are different during repetitive avalanches. The degradation rates are unequal for parallel devices with different case temperatures. Two degradation mechanisms, including hot holes injection and trapping in the gate oxide and metal aging, are found to dominate in the repetitive avalanche process. The findings are helpful for better understanding of degradations for parallel repetitive avalanches in device applications.
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