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Abstract
In the field of microelectronic packaging technology, isotropic conductive adhesives (ICAs) have been used widely as interconnection materials between chips and substrates. ICAs are composed of silver powder particles and adhesive matrix. The paper analysed the rheological properties of ICAs at different temperatures in order to better apply ICAs in dispensing and jet printing processes. The viscosity, viscoelasticity, and thixotropic behaviours of ICAs were studied using various experimental methods such as oscillatory stress shear, and rotational rheology. The rheological behaviours of ICAs conforms to the Cross Model. In SAOS flow field, the ICAs has G”>G’ in LVR region, which shows the viscous component is dominant and ICAs represent viscoelastic fluid characteristics.
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