Investigation on Residual Stress Development During Multiple Impacts in Cold Spray Process

Abstract

Abstract The Cold Spray Process (CS) is a solid-state particle deposition process. Unlike thermal spray coating methods, the CS process does not involve melting of the particles and thus retains the desired original material properties along with oxide-free deposition. As the technology is of dynamic nature with high-velocity particle impacts, the bonding mechanism involved is hugely complicated to understand. Even though the CS process offers great benefits, its potential applications are restrained by a lack of knowledge of the complex operations involved. Preliminary research which used molecular dynamics (MD) simulation of the CS process revealed that factors including the angle of impact, size of particle and impact velocity significantly affect the material deposition. However, the preliminary study only considered a single particle impact during the coating process. The CS process involves the impact of multiple particles on the substrate surface depositing layer-by-layer. This research focuses on investigating the residual stresses distribution caused by the impact of multiple nanoparticles on the substrate surface during the CS process using MD simulation technique. The results obtained by this study are instrumental in further advancing the applications of the CS processes.