Abstract

The passivation machenism of Ge surface by germanium suboxide GeO­x is investigated. The interface state density (Dit) measured from low temperature conduction method is found to decrease with increasing the GeOx thickness (0.26-1.06 nm). The X-ray photoelectron spectroscopy (XPS) is employed to demonstrate the interfacial structure of GeOx/Ge with different GeOx thicknesses. And the XPS results show that Ge3+ oxide component is responsible to the decrease of the Dit due to the effective passivation of Ge dangling bonds. Therefore, the formation of Ge3+ component is the dominant key to achieve low Dit for Ge gate stacks. Our work confirms that the same physical mechanism determines the Ge surface passivation by the GeOx regardless of the oxidation methods to grow the GeOx interfacial layer. As a result, to explore a growth process that can realize sufficient Ge3+ component in the GeOx interlayer as thin as possible is important to achieve both equivalent oxide thickness scaling and superior interfacial property simultaneously. This conclusion is helpful to engineer the optimization of the Ge gate stacks. Figure 1

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call