Investigation on femtosecond laser combined with dynamic wet etching machining of SiC/SiC

Abstract

SiC/SiC (Silicon Carbide fiber reinforced Silicon Carbide) is widely used in aerospace and gas turbine fields due to its excellent resistance to high temperature, corrosion and low density. However, the difficult processing of SiC/SiC is the main factor limiting its further application. To address these issues, this paper proposes a novel method for processing SiC/SiC using femtosecond laser combined with dynamic wet etching. A comparative analysis of the micro-pore morphology and elemental composition obtained through processing in air, water, and NaOH solution is presented. Demonstrates the excellent surface quality achieved with NaOH processing, which effectively reduces defects such as recast layers and microcracks. The results suggest that the operating mechanism involves the combined effects of a wet-oxygen coupling environment, high-temperature decomposition, localized chemical wet etching, and the influence of the liquid layer.