Investigation on conduction heat dissipation for thermal management in distributed multi-point electronic chips

Abstract

A conduction thermal dissipation system is designed for the thermal management of distributed multi-point electronic chips. The heat from the chips is conducted to the flow channel on the two sides with the help of heat pipes. For the purpose of improving the heat dissipation performance, the influence of different flow channel structures was analyzed with the help of numerical simulations. When the fin thickness and spacing are 0.4/0.5 mm, the heat transfer performance is optimal with acceptable flow pressure drop. The results indicated that temperature and uniformity meet the requirements of the electronic chips. The temperature of the chips is lower than 80°C at 1500 W under the condition of the 35°C ethylene glycol solution with 200 L/h. The impact of thermal interface materials on thermal performance was also experimentally studied. The results showed that the graphite interface material has an excellent comprehensive performance with good thermal conductivity and convenient application. This method of distributed multi-point chips and two-sided heat dissipation is more effective in fully utilizing the advantage of heat pipes compared to the traditional usage of evaporation and condensation located on the two sides.