Abstract
AbstractA test system has been assembled to examine factors controlling the reliability of microdevice switching. The system consists of a spherically tipped sputter-coated post driven by a piezoresistive actuator into a sputter-coated micromechanical membrane. Contact forces are calculated based upon the measured deflection of the micromechanical membrane, which is induced by post actuation. Membrane deflection is measured using white light interferometry. The known geometry of the membrane and probe tip permits the estimation of contact area and, hence, contact pressure. Preliminary testing of sputtered gold contacts resulted in localized melting, material transport to the membrane and failure of contact surfaces at relatively low contact pressures and current densities. Further testing will examine the factors governing the reliability of microdevice contacts, such as material properties, contact pressure and current density.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
