Abstract
Abstract In this study, the dynamic-mechanical properties and thermal behavior of the nanocomposites of a photocurable epoxy-acrylate resin and CuO nanohybrid were determined. In order to improve the dispersion of CuO nanoparticles and prevention of nanoparticle migration to the surface coating, the surface of commercial nanoparticles was modified by triethoxymethylsilane (TEMS) and vinyltrimethoxysilane (VTMS) as silane-coupling agents. Dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), and differential scanning calorimetry (DSC) tests were then performed on CuO-filled epoxy-acrylate resins to identify the loading effect on the properties of material. The thermal stability of nanocomposites was affected slightly after incorporation of CuO nanoparticles. DMA studies revealed that filling the CuO nanoparticles into epoxy-acrylate resin can produce a significant enhancement in storage modulus, as well as a shift in the glass transition temperature. The films reinforced with the modified CuO exhibit the most significant enhancements in properties.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
