Abstract
The aim of this paper is to get insight into measurement uncertainties for thermomechanical measurements performed using a piezoresistive silicon-based stress sensor in a standard microelectronic package. All used sensors have the same construction, were produced in the same technological processes at the same time, yet the measurement results show significant distribution. The possible causes for this phenomenon are discussed in this paper. Additionally, Finite Element Method (FEM) model is created and validated, what enables a study of sensitive parameters influencing the measurement uncertainties.
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