Investigation of TiN/TiSi2Bilayer Thin Films on Si (100) Substrate

Abstract

AbstractIn this work the conditions of forming a bi – layer structure of TiN/TiSi2thin film on Si (100) substrate is investigated. Two methods of producing this structure were used: a) Deposition of Ti on Si (100), followed by reactive sputtering to obtain TiN on top of this layer and b) codeposition of Ti and Si on Si (100) and then deposition of TiN by reactive sputtering. The reactive sputtering was carried out in a mixture of N2/Ar with 20% N2. This amount is believed to be optimal for obtaining good quality and stoichiometric TiN films. Annealing is essential to form TiSi2and it was performed either in the sputtering chamber immediately after the deposition or by rapid thermal annealing (RTA). The structure of the specimens was analyzed by X-ray diffraction using step scanning, Auger electron spectroscopy (AES) and transmission electron microscopy (TEM). TEM analysis was done on cross sectional specimens and also electron diffraction results were recorded. Resistivity measurements were performed by four – point probe method. The influence of TiN on the silicide formation was established. The results indicate that in the presence of TiN the phase TiSi2was obtained, but in its absence Ti5Si3is formed under the same conditions of deposition and annealing. The stress distribution was investigated by Hall – Williamson curves and it was found that TiN stabilizes the silicide film and no peeling was observed. The effectiveness of TiN as diffusion barrier against Al and Si penetration was tested at 500°C/lh. It was found, that under these conditions, the TIN/TiSi2structure is about the same, as before the heat treatment. No Al penetration is observed.