Abstract
The heteroepitaxial growth of gallium nitride (GaN) films using three distinct growth steps is investigated in terms of improving the electrical properties of the layer. The first step involves the deposition of a fixed quality aluminum nitride (AlN) layer on an a-plane sapphire substrate. The second step is aimed at maximizing the GaN grain size initially grown on the AlN. The third step is aimed at optimizing the surface morphology of the GaN layer. The means of transitioning the growth between steps is investigated and an optimum transition method is reported. Growth parameters investigated include pressure, trimethylgallium molar flow rate, and ratio of group V to group III precursor molar flows. Carrier statistics show a lower level of compensation in films grown at a slower growth rate in the second step and a moderate rate in the third step.
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