Abstract
To investigate the heat dissipation characteristics, we prepared three types of LED packages with different mold thicknesses: 0.7, 1.4, and 2.8 mm. The mold surface temperature (TM) was measured with a thermocouple. An optimum solution for the heat dissipation model was realized using the variation of TM versus mold thickness. Our results show that the rate of heat dissipation through the side wall of the ceramic package was increased from 0.11 to 0.26 W by increasing the mold thickness from 0.7 to 2.8 mm, which played a role in decreasing junction temperature (TJ) from 154 to 128 °C and TM from 128 to 77 °C. This is in good agreement with the experimentally measured values of TM. In the case of the 2.8-mm-thick mold, we determined that 35% of the total heat generated from the p–n junction of the LED chip dissipated through the side wall of the ceramic package.
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