Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process

Abstract

The material combination of aluminum and copper is increasingly coming into focus, especially for electrical contact applications. Investigations of different casting processes show that a significant influence for the formation of a material bond is the thermal impact. For high-pressure die casting (HPDC) processes, the impact is quite low, e.g., due to short cycle times. Despite the high efficiency of this technology, currently there are hardly any investigations in this respect. So, the technology was used in this study to produce aluminum–copper compounds and analyze interfacial layers by means of SEM images and EDX measurements. Furthermore, the mechanical and electrical properties of the compounds were determined by means of tensile shear tests and measurements of the electrical conductivity. By modifying specimen geometry, the thermal impact could be increased and, thus, enhanced compound properties were achieved. Overall, compounds of sufficiently high mechanical strength, as well as electrical conductivity, could be produced by HPDC processes, demonstrating the high technical and economic potential of this casting technique.