Investigation of the Long‐Term Storage Stability of Shape Memory Epoxy Prepolymer

Abstract

Epoxy‐based shape memory polymers (ESMPs) are important types of thermoset shape memory polymers due to their unique thermomechanical properties, which have great potential in applications ranging from smart actuators to deformable structures. The long‐term storage stability is important for ESMPs, especially when pursuing the same batch of materials for alternatives. Stable storage of ESMP preplomyers in the long term and taking it out for curing when needed are of great benefit to engineering applications which highly require the same batch of materials for high production efficiency, such as in deployable space structures, semiconductor, and electronic packaging. However, this important storage stability of ESMP has not been studied so far. Herein, a series of ESMPs with tunable glass transition temperatures (Tgs) ranging from 100 to 170 °C is prepared. The effect of long‐term storage at low temperatures on rheological, thermal, thermomechanical, mechanical, and shape memory properties is systematically investigated. The ESMP after storage shows an improvement of crosslinking density, Tgs, and mechanical strength, while maintaining chemical structures and excellent shape memory properties. This feasible method of low‐temperature storage realizes overall long‐term stability and enhancement of strength in ESMPs, making it more promising for engineering applications.