Abstract
ABSTRACTThe growth of reactively sputtered TiNx and WNx compound metal films on ultra-thin, remote plasma enhanced chemical vapor deposited SiO2 and SiO2/Si3N4 (ON) stack dielectrics is investigated from initial interface formation to bulk film by interrupted growth and on-line Auger electron spectroscopy (AES). Growth of both metals occurs uniformly without a seed layer on both dielectrics. The chemical stability of these metal/dielectric interfaces is studied by sequential on-line rapid thermal annealing treatments up to 850 °C and AES. TiNx reacts with SiO2 above 850 °C but the addition of a Si3N4 dielectric top-layer makes the TiNx/ON interface chemically stable at 850 °C. WNx/SiO2 and WNx/Si3N4 interfaces are both stable below 650 °C. MOS capacitors using TiNx or WNx metal gates and thermal SiO2 gate dielectrics exhibit excellent capacitance-voltage characteristics. The work function for TiNx lies near midgap in Si while for WNx it lies closer to the valence band.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
