Abstract
One of main issues when evaluating or analysing quality and functional properties of work-piece is identification of status of residual stress. Every treatment or machining process generates residual stress in the surface and subsurface layers of the material structure. The residual stress has a large influence on the functional properties of the components. The article is focused on the method of triaxial measurement of residual stress after machining the surface of sample by high feed milling technology. Significance of triaxial measuring is the capability of measuring in different angles so it is possible to acquire stress tensor containing normal and shear stress components acting in the spot of measuring, using a Cartesian coordinate system.
Highlights
Residual stresses are an integral part of manufactured workpieces, whether they are introduced deliberately, as a part of the design, as a by-product of a process carried out during the manufacturing process, or are present as the product of the component’s service history
Residual stresses can be formed below the machined surface only if there is a plastic deformation in the surface layer
The significance of triaxial residual stress measurement is measuring at various angles φ, so it is possible to obtain a stress tensor containing normal and shear stress components acting at the point of measurement
Summary
Residual stresses are an integral part of manufactured workpieces, whether they are introduced deliberately, as a part of the design, as a by-product of a process carried out during the manufacturing process, or are present as the product of the component’s service history. Type I Stresses (Fig. 1 - σI): Macro-stresses occurring over distances that involve many grains within a material. Type II Stresses (Fig. 1 - σII): Micro-stresses caused by differences in the microstructure of a material and occur over distances comparable to the size of the grain in the material. They can occur in single-phase materials due to the anisotropic. As long as the stress is zero, the distance of crystallographic planes only depends on the material properties These distances can vary by the influence of the residual stress. The incident X-ray beam penetrates the surface layers of the material, where depending on the crystallographic planes distance it diffracts to the diffraction cone recorded on the detectors [2, 14 - 16]
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