Abstract
A retainer ring structure was investigated to improve non-uniformity in a chemical mechanical planarization (CMP) process. During the CMP process, the stress distribution on the wafer affects the CMP performance in terms of material removal rate (MRR) and within-wafer non-uniformity (WIWNU). The non-uniformity is related to edge exclusion and affects the process yield. For this purpose, the stress distribution between pad and wafer was calculated via the finite-element method (FEM) and compared with the experimental results of a 300 mm wafer polishing test. The retainer ring with a step structure exhibited an improved stress distribution along the wafer surface. Consequently, the non-uniformity was improved by 16.6 %. These results can be used to optimize CMP processes (in particular, CMP retainer ring structures) and determine adequate process conditions.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
