Investigation of shrinkage-induced stresses in stereolithography photo-curable resins

Abstract

An experimental study has been undertaken to investigate the shrinkage characteristics of acrylic-based and epoxy-based stereolithography (SL) photopolymer resin systems after they have been laser cured and post-cured under ultraviolet (UV), and thermal exposure. The induced residual stresses and strains were determined by the shadow moire and the hole-drilling strain-gage methods. Out-of-plane displacements (warpage) of acrylic-based post-cured resin plates were recorded by means of the shadow moire method and correlated to the shrinkage strains by theoretical analysis. The induced residual stresses in the epoxy-based cylindrical resin specimens were determined from strains of three-element strain-gage rosettes of the blind-hole drilling method. Results are presented for the shrinkage stresses and strains for both material systems as a function of the post-curing process (UV, thermal). It was found that the shrinkage strains in the acrylic-based photopolymer resin were of considerable magnitude, while thermal post-curing resulted in higher shrinkage stresses for both material systems. The values of the shrinkage stresses compare well with those of the existing literature.