Abstract
In this study, nitrogen-rich Hafnium Nitride (HfN) featuring insulating properties was investigated for achieving resistive switching, crucial for the functionality of resistive random-access memory (ReRAM) devices. Devices were fabricated with a 15-nm HfN resistive switching layer using a Radio Frequency (RF) sputtering system. The fabricated devices successfully exhibited a bipolar switching characteristic with a high On/Off ratio (up to 104). An interesting 2-step behavior was also observed during the formation of the conduction filament which was suspected to be tied to the migration of the nitrogen ions. This is the first attempt at using HfN as the resistive switching material for nonvolatile memory applications.
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