Investigation of Reactive Origin for Attachment of Cu Droplets to Solid Particles

Abstract

Both primary and secondary copper productions encounter a limitation in the process efficiency due to droplet losses in slags. One of the causes for the mechanical entrainment of these droplets is their interaction with solid spinel particles, hindering the sedimentation of the copper droplets. Previous experiments with synthetic slags provided insights into this interaction and yielded two possible mechanisms: separately formed droplets and particles become attached to one another due to fierce agitation of the slag and metal phases; or the spinel particles and metal droplets form as the result of a chemical reaction together with a new droplet or alongside a droplet that was already present in the system. This experimental study aims to investigate the hypothesis of the formation of copper droplets sticking to spinel particles due to a chemical reaction further. A slag that is initially free from Cu droplets was prepared. After creating controlled conditions to induce the chemical reaction, the formation of sticking droplets was observed. The results from this experiment therefore confirm the previously proposed reactive mechanism.