Abstract
The tin-copper alloys are widely used in various applications, such as jewelry, antiques, bearings, and electronics due to their superior advantages in several aspects such as corrosion resistance, lubrication, and visual appearance, etc. One of the dominant coating processes to fabricate such an alloy is the electrodeposition since it helps to improve several advantages, such as low processing cost, good surface finish, and flexible method. However, the electrodeposition in a solution containing tin often causes whisker growth, which results in rough and poor surface finish. Therefore, this study aims to investigate the effect of electrodeposition's pulsing current densities (33%, 50%, 67%, and 100%) and electrodeposition's temperatures (25 °C, 45 °C, and 60 °C) on tin-copper alloys' electrodeposits. The electrodeposits are all characterized for microstructures, chemical compositions, crystalline phases, corrosion resistance, and adhesivity. The information regarding those characterizations is discussed in this study.
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