Abstract
The possibility of realisation of superplastic state of nanostructured (NS) copper (grain size 0.1–0.3 μm) produced by equal-channel angular pressing has been studied during creep and tensile tests in vacuum and under the influence of aluminium grain boundary diffusion fluxes from external source (coating). The creep acceleration effect for NS copper under the influence of aluminium grain boundary diffusion fluxes is found. The effect takes place in a lower temperature range as compared with fine-grained copper. It has been established that at 473K strong increase of strain rate sensitivity (m = ∂ lgσ ∂ lg ϵ) takes place during deformation of copper under influence of aluminium diffusion fluxes (m = 0.5) in comparison with pure copper (m = 0.19)
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