Investigation of molten metal droplet deposition and solidification for 3D printing techniques

Abstract

This study investigated the transient transport phenomenon during the pile up of molten lead-free solder via the inkjet printing method. With regard to the droplet impact velocity, the distance from nozzle to substrate can be controlled by using the pulse voltage and distance control apparatus. A high-speed digital camera was used to record the solder impact and examine the accuracy of the pile up. These impact conditions correspond to We = 2.1–15.1 and Oh = 5.4 × 10−3–3.8 × 10−3. The effects of impact velocity and relative distance between two types of molten droplets on the shape of the impact mode are examined. The results show that the optimal parameters of the distance from nozzle to substrate and the spreading factor in this experiment are 0.5 mm and 1.33. The diameter, volume and velocity of the inkjet solder droplet are around 37–65 μm, 25–144 picoliters, and 2.0–3.7 m s−1, respectively. The vertical and inclined column structures of molten lead-free solder can be fabricated using piezoelectric ink-jet printing systems. The end-shapes of the 3D micro structure have been found to be dependent upon the distance from nozzle to substrate and the impact velocity of the molten lead-free solder droplet.