Abstract

Moisture absorption results in a variety of failures to plastic packaging devices. In order to gain insight the mechanism, it is necessary to carry out a molecular level investigation. In this paper, molecular dynamics (MD) simulations were conducted to investigate the moisture diffusion coefficients of the moisture into the epoxy molding compound (EMC) and the EMC/Cu interface at different temperatures and with different amount of moisture absorbed by the system. The results show that the diffusion coefficient increases at high temperature and with a low amount of moisture containing in the EMC. At the same condition, the diffusion coefficient of moisture through the interface of EMC/Cu is higher than in the EMC. Also, the hydrogen bonds were found to play a significant role at elevated temperatures in increasing the diffusion coefficient.

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