Abstract
The underpotential and bulk deposition of a metal onto a foreign metal substrate was monitored with ellipsometry in combination with cyclic voltammetry. Deposit—substrate systems were investigated for which the refractive index of the bulk deposit is respectively larger, about equal and smaller than N substrate, viz lead deposition on gold and platinum and copper deposition on platinum. The refractive index of the Pb—UPD film on au was found to be intermediate between N Pb and N Au. Bulk lead is deposited already when the coverage is about three monolayers; furthermore alloy formation was established at longer deposition times. Also for the Cu—UPD flm on Pt, a refractive index was obtained in between the values of substrate and bulk deposit. Homogeneous deposition of bulk Cu occurs if E < −0.60 V vs mse. For the PbPt system the refractive indices of the UPD layer and the bulk deposit do not differ much.
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