Abstract
In the photovoltaic and semiconductor industries silicon wafers are sliced using the wire saw process. This process is also used to machine almost all kinds of brittle materials where high yield and low surface damage is desired. The wire saw process induces roughness and long waviness on the cut surface. These defects have to be removed by post-process techniques including grinding and lapping, which increases costs. The present study investigated the long waviness induced by the wire saw process. An analytical model for long waviness generation has been developed. Experimental work was conducted with different process parameters. The analytical model is capable of explaining the long waviness generation observed in experimental work. Process design recommendations with minimal waviness and high efficiency are presented.
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Schedule a callMore From: Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
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