Abstract
In this study, a multifunctional micro-moiré interferometry (M 3I) system is developed for the measurement of in-situ deformation of microelectronic packages. Firstly, the system is applied to measure the in-situ deformation of solder interconnections in a plastic ball grid array (PBGA) assembly subjected to temperature cycling (TC) loading. The experimental results demonstrate that by combining with fatigue life prediction model the system can be used as a quick and accurate experimental tool for the assessment of long-term reliability of microelectronic packages. Secondly, with a specially designed brazil nut (BN) loading fixture, the system is employed to determine the displacement field around the tip of interfacial crack in a solder joint under different mechanical loading configurations. The effective critical fracture toughness and mode mixity of the solder/copper interface are determined with the system. Those results are further used to explain the failure mode and mechanism of solder joint during the reliability experiments.
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