Abstract
Laser spike anneal (LSA) is applied in advanced CMOS device fabrication to achieve efficient dopant activation without excess dopant diffusion. Dwell time, defined as the ratio of full width at half maximum of laser beam and beam scan speed, is found to be a critical and effective knob in LSA processes. In this work, different dwell time of LSA and its impact on dope activation, junction profile, and compatibility with embedded SiGe (e-SiGe) was studied. Dwell time in the range of 800us to 275us has been investigated. LSA processes with different dwell time result in similar dopant activation and almost identical doping profile. On the other hand, reduced dwell time resulted in significant improvement in wafer warpage and overlay performance, when LSA is applied on CMOS devices with e-SiGe S/D pMOSFET. With electrical results consistent with offline characterization, this work indicated that lower dwell time LSA is more flexible and compatible with e-SiGe process for advanced CMOS devices.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
