Abstract
If a failure of a function is reported for a limited period of time and subsequent recovery of the function in a product, it’s called intermittent failure. The intermittent failure is one of the causes of no-fault-found (NFF). It was reported that electrical interconnections are one of the most detrimental sources for the intermittent failure of electronic devices in vibration environment. In this study, intermittent failure in electrical interconnections is investigated. Printed circuit board (PCB) and flexible PCB (FPCB) are designed with several types of electrical interconnections. Electronic devices are also developed to measure the intermittent failure of the interconnections. Vibration and thermal cycling tests are conducted for the interconnections and intermittent failures are monitored in real-time. The failure analysis for the site of intermittent failure occurrences reveals the cause of the failure
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