Abstract
With the rapid development of microelectronics industry, 3D integrated circuit (3D-IC) packaging technology is gradually applied in power electronic devices due to its high frequency, high integration and high intelligence. Transient Liquid Phase (TLP) connection technology based on Cu/Sn/Cu system has the most practical background and research value. To improve the mechanical reliability of Sn solder joint, Nd particles were doped into solder. In this study, Sn interconnect solder doping Nd particles were fabricated by TLP technology, and then the impact of Nd particles on the interfacial reaction and shear behavior of the composite solder joints was investigated. By means of Nd element was added into solder to refine its microstructure, so as to improve the joint mechanical properties.
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