Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: modeling and evaluation

Abstract

Interfacial delamination is of important concern for multilayered microelectronic packages, as it is one of the most common failures observed after reliability test. Most of the work, available in open literature, focus on delamination propagation under monotonic loading rather than delamination propagation under cyclic loading. Interfacial fracture mechanics based methodologies have been proven to be efficient in handling interfacial delamination problem under monotonic loading. In this paper, the principles of interfacial mechanics have been applied in the analysis of interfacial fatigue crack propagation. Fatigue test has been conducted in studying onset of delamination and fatigue crack propagation (FCP) of an interfacial crack along a copper-epoxy interface. Models developed in this study have also been applied in the evaluation of multilayered integrated substrate test vehicles.