Investigation of Interfaces by Atom Probe Tomography

Abstract

We investigated the thermodynamic and transport properties of buried interfaces with atom probe tomography. Owing to the 3D subnanometer resolution and single atom sensitivity of the method, it is possible to obtain composition profiles with high accuracy both along or normal to the interfaces. We have shown that the width of the chemical interface between the Fe and Cr system follows the Cahn–Hilliard relation with a gradient energy coefficient of 1.86 × 10−22 J nm2. Sharpening of the Ni/Cu interface as a result of kinetic control was directly observed. We investigated the grain boundary and triple junction transport in Fe/Cr and Ni/Cu. Cr segregation enthalpy into Fe triple junctions was found to be 0.076 eV, which falls in between the surface (0.159 eV) and grain boundary (0.03 eV) segregation enthalpies. In the investigated 563 K to 643 K (290 °C to 370 °C) range, Ni transport is 200 to 300 times faster in the triple junctions of Cu than in the grain boundaries. The diffusion activation enthalpy in the triple junctions is two-thirds that of the grain boundaries (0.86 and 1.24 eV, respectively). These investigations have shown that triple junctions are defects in their own right with characteristic segregation and diffusion properties: They are preferred segregation sites and can be considered as a diffusion shortcut in the grain boundary network.