Abstract

The properties of micromechanically exfoliated graphene on different oxide dielectrics—SiO2,Al2O3, andHfO2—are investigated by Raman spectroscopy and AFM measurement. The pristine graphenehas stronger adhesion and a higher hole concentration when the dielectric constant of theunderlying oxide is higher. It is found that annealing under a high vacuum significantlyenhances the adhesion between graphene and the oxides and causes a shift of the Raman Gand 2D bands to a higher wavelength. The high vacuum annealing also causes an increasein carrier concentration of up to ten times with a corresponding Fermi level shift of ∼ 0.65 eV forgraphene on HfO2. On the other hand, the high vacuum annealing of graphene onSiO2 induces a biaxial compressive stress as high as 4 GPa on graphene. The results provideunderstanding on the interaction of graphene and oxides, which is essential for successfulrealization of graphene-based electronic devices.

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