Investigation of hollow cathode effects on the structure of bulk films

Abstract

In a hollow cathode discharge, there is a higher degree of ionization than in the abnormal glow discharge which is characteristic of sputtering and ion plating. A hollow cathode discharge was formed between parallel plates. Metal was evaporated from a source below the hollow cathode and was deposited onto the cathode plates. The pressure–voltage-plate spacing relationship between the cathode plates was related to the deposition efficiency. The grain structure of the deposited metal is reported upon. The evaporation source was a boat-type evaporator. The source metals were copper and silver.